Packaging Engineer applicants have rated the interview process at Texas Instruments with 3.2 out of 5 (where 5 is the highest level of difficulty) and assessed their interview experience as 83% positive. To compare, the company-average is 72% positive. This is according to Glassdoor user ratings.
Candidates applying for Packaging Engineer roles take an average of 26 days to get hired, when considering 6 user submitted interviews for this role. To compare, the hiring process at Texas Instruments overall takes an average of 24 days.
Common stages of the interview process at Texas Instruments as a Packaging Engineer according to 6 Glassdoor interviews include:
One on one interview: 19%
Phone interview: 19%
Background check: 13%
Group panel interview: 13%
Skills test: 13%
Personality test: 13%
Other: 6%
Drug test: 6%
Here are the most commonly searched roles for interview reports -
I applied online. I interviewed at Texas Instruments in Jan 2023
Interview
Short noticed but they are very accomodating with the inquiries. Nothing much about the technical questions. It is more like the "getting to know you" stage in the interview, but always be prepared. The people are nice and friendly working environment.
Interview questions [1]
Question 1
How was your experienced working in a team setting?
As an intern, the exposure is very good and the quick-paced environment promotes learning graph. Moreover, the seniors and technicians are friendly and willing to help and answer the questions.
I applied online. The process took 4 weeks. I interviewed at Texas Instruments (Santa Clara, CA) in Dec 2022
Interview
One technical round with basic questions from your projects and the general processes in packaging and advanced packaging knowledge. It is a phone screen and then an interview - sometimes 2
Interview questions [1]
Question 1
1. Project specific 2. Packaging knowledge 3. Fundamental coursework